B&R X20PS2100 Internal I/O Supply Module

B&R X20PS2100 設置マニュアル (Engineering Version, compiled per official B&R X20 System Manual)

モデル: X20PS2100; Conformal coated variant: X20cPS2100

フルモデル: X20PS2100 (Conformal Coated Version: X20cPS2100)

関数: Internal I/O power supply module for X20 system

✅ Supplies power only to the internal I/O electronics on the backplane segment

❌ Does NOT provide power for X2X Link bus (Critical Distinction)

Simple explanation: Powers the electronic circuits of DI/DO/AI/AO modules on the local backplane segment; cannot supply power across segments for X2X bus expansion

1. コアの電気仕様

Ambient Temperature Ratings

Horizontal mounting: -25 ℃ … +60 ℃

垂直取り付け: -25 ℃ … +50 ℃

Elevation above 2000 メートル: Derate maximum ambient temperature by 0.5 ℃あたり 100 メートル

2. Mandatory Matching Accessories (Ordered Separately)
3. Bus Module (Select one)

X20BM01: Power supply bus module, without node address switch

X20BM05: Power supply bus module, with X2X node address switch

関数: Blocks power transmission to the left backplane for segmented power feeding

2. 端子台: X20TB12 (12-ピン, 24 VDC keyed terminal)
3. Comparison with Peer Power Supply Modules (Key for Selection)

⚠️ Common mistake: Attempting to drive X2X expansion modules using X20PS2100 → System will not operate. X20PS3300 must be used.

4. LED Indicator Definition

走る (緑): Steady ON = Module normal; OFF = No 24V supply / 故障

エラー (赤): の上 / Flashing = Abnormal supply, 過負荷, 配線不良

5. 配線 & Engineering Guidelines
6. Terminals accept +24V / 0V feed to power the current backplane segment;
7. X20BM01/X20BM05 blocks power to the left, enabling independent segmented power feeding for multiple modules to mitigate voltage drop;
8. Recommended external protection: マックス. 10 A slow-blow fuse;
9. Hot swapping is not supported;
10. Multiple X20PS2100 modules can be connected in parallel on one backplane segment to increase available supply current.
11. 認証

CE, UL cULus, ATEX Zone2, Class I Div.2 (suitable for hazardous area Zone2), DNV, ABS Marine Approval, KC

7. 典型的なアプリケーションシナリオ

Local I/O stations for machine tools, packaging lines, 射出成形機; segmented power supply for X20 local stations on small-to-medium equipment without X2X cross-segment expansion.

8. クイックトラブルシューティング
9. RUN LED OFF: Missing external 24 VDC, loose X20TB12 terminals, reversed power polarity
10. ERR LED steady ON: Backplane short circuit, overcurrent beyond limit
11. Partial modules fail to power up: Check orientation of X20BM01/X20BM05, verify segmented power logic

If required, I can provide:

Complete pin assignment of X20TB12

Text schematic of standard segmented backplane wiring

Extracted key pages from official X20PS2100 datasheet

Or evaluate whether upgrading to X20PS3300 is required for your application.

Function Definition: X20 system internal I/O power supply module (supplies power only to local backplane I/O circuits, X2X Link bus power is not supported)

⚠️ Important Note: B&R does NOT issue an independent standalone installation manual for X20PS2100. Relevant specifications are documented in X20 System User’s Manual. This document is standardized for on-site commissioning and cabinet design.

Table of Contents

1. Pre-installation Safety Instructions
2. List of Mandatory Matching Components
3. 機械的設置仕様
4. Backplane Layout Rules (Critical – Frequent Source of Errors)
5. X20TB12 Terminal Pinout & 配線仕様
6. LED Status Diagnosis
7. 電気仕様 & 周囲条件
8. Fuse Selection & Earthing Guidelines
9. Standard Power-on Commissioning Procedures
10. Fault Diagnosis Matrix
11. 選択 & Installation Taboos
12. Pre-installation Safety Instructions
13. All installation and disassembly operations must be performed with 24 VDC power disconnected. Hot swapping is NOT supported.
14. Modules are rated IP20 and shall only be installed inside electrical control cabinets.
15. Implement ESD protection (wear anti-static wrist strap) before handling to prevent electrostatic damage to backplane circuits.
16. Strictly prohibit reverse polarity input; avoid input voltage exceeding 28.8 VDC.
17. No galvanic isolation exists between I/O supply and backplane. Not applicable for signal circuits requiring electrical isolation.
18. Temperature derating is mandatory for installation elevation above 2000 メートル.
19. Mandatory Matching Components (Supplied Separately, not included with module)

Optional spares: X20 label strips, wire end ferrules for push-in terminals

3. 機械的設置仕様

3.1 DIN Rail Requirement

標準 35 mm TH35 DIN rail; モジュール幅: 12.5 mm

3.2 取付方向 & Temperature Limits

ストレージ / 輸送温度: -40 ℃～ +85 ℃

相対湿度: 5%～95%, Condensation is prohibited

Elevation 2000 メートル: Reduce maximum ambient temperature by 0.5 ℃あたり 100 メートル

3.3 インストール手順

1. Hook the top latch onto DIN rail;
2. Press down the bottom of the module until an audible click confirms secure locking;
3. Butt tightly against adjacent modules to complete backplane interconnection;
4. 除去: Lift the bottom latch upward and pull outward to extract the module.
5. Backplane Layout Rules (Core Engineering Requirement)

✅ Standard Layout Order (左から右へ)

`X20BM01 / X20BM05 → X20PS2100 → DI/DO/AI/AO I/O Modules`

基本原則

Hardware characteristic of X20BM01/X20BM05: Blocks I/O power transmission to the left

→ X20PS2100 supplies power only to all modules on its right side; modules on the left receive no power from this unit.

Permitted Configurations

1. Single backplane segment: BM01 + PS2100 + I/Oモジュール
2. Multi-segment independent power feeding: `BM01+PS2100 + I/O + BM01+PS2100 + I/O` for voltage drop reduction
3. Multiple X20PS2100 modules can be paralleled on the same segment to increase total supply capacity.

❌ Strictly Forbidden Layout Errors

1. Place PS2100 on the left side of the bus module
2. Use PS2100 to power X2X Link expansion backplanes (cross-segment power supply fails; X20PS3300 required)
3. Omit X20BM01/X20BM05 directly in front of PS2100, causing reverse power crosstalk between backplane segments
4. X20TB12 Pin Assignment for X20PS2100

Active pins among terminals 1~12:

配線仕様

1. Cable cross-section: 0.5 ～ 2.5 mm² stranded copper wires; wire end ferrules recommended for push-in terminals
2. Route power cables separately from analog signal cables to minimize interference
3. Do NOT connect field sensor loads directly to these terminals. Terminals are solely for backplane power feed.
4. Front Panel LED Definition

Two LEDs on module front: 走る (緑), エラー (赤)

7. 電気仕様

Nominal Input: 24 VDC; 動作範囲: 20.4 VDC ~ 28.8 VDC (-15% ～ +20%)

Maximum feed-in current: 10 あ

Module self-consumption: Bus side 0.2 W; I/O circuit 0.6 W

絶縁: No galvanic isolation between I/O supply and backplane

保護クラス: IP20

8. ヒューズ & Earthing Engineering Specifications
9. Mandatory external fuse requirement

Install a ≤10 A slow-blow (time-delay) fuse upstream of the circuit

❌ No internal fuse fitted in the module; short-circuit risk may permanently damage the backplane!

2. Earthing Recommendations

Implement single-point earthing for 24 VDC 0V; separate cabinet protective earth (PE) and power ground wiring.

For high-interference environments, fit EMC filter capacitor between 0V and PE.

9. Standard Power-on Commissioning Procedure
10. Complete mechanical installation and confirm full backplane interconnection;
11. Wire X20TB12 power terminals and double-check polarity;
12. Verify 24 VDC supply via multimeter;
13. Close external power switch;
14. Confirm RUN LED steady ON and ERR LED extinguished;
15. Scan hardware via Automation Studio to verify all I/O modules on this segment are detected normally;
16. Measure backplane supply voltage at remote modules to confirm acceptable voltage drop.
17. Fault Diagnosis Matrix

11. 選択 & Installation Taboos Summary
12. X20PS2100 cannot supply power for X2X expansion links. Select X20PS3300 for distributed remote stations.
13. X20BM01/X20BM05 cannot be omitted.
14. Hot swap is prohibited.
15. Cannot be used as power output for external sensors and actuators; only for internal X20 backplane electronics.
16. For safety circuits requiring I/O supply disconnection, hardware revision Rev.F0 or newer is mandatory.

Access to Official Original Manual

Download X20 System User Manual (Document No.: UM200.440) from B&R official website; section 4.27 contains full specifications of X20PS2100.

Upon request I can provide:

1. Terminal definitions ready for direct import into EPLAN
2. Text-based backplane wiring schematic
3. Full comparison table between X20PS2100 and X20PS3300 for selection

一般的な障害, Root Causes & Standard Remedial Measures for B&R X20 I/O System

Covers backplane, power modules (X20PS2100/PS3300), bus modules, digital/analog I/O modules, X2X Link expansion and Automation Studio recognition issues. Classified into four categories: Hardware faults, wiring faults, configuration faults, EMC interference.

Applicable hardware: X20CPU, X20BC bus controller, X20PS power modules, X20DI/DO/AI/AO, X20BM bus modules, X2X remote stations

1. Power Supply Related Faults (Most Frequent, Especially with X20PS2100)

1.1 Partial I/O modules fail to power up, undetected in Automation Studio

症状: Front modules on one backplane segment operate normally, remote modules fail to start; RUN LED OFF

Typical Causes

1. X20BM01/X20BM05 installed backwards or misplaced, blocking power transmission
2. X20PS2100 only supports local segment I/O power; cannot feed X2X remote stations
3. Heavy backplane load, thin cables leading to undervoltage below 20.4 VDC at remote positions
4. Blown external fuse, loose TB terminals

是正措置

Layout rule: Bus module installed left of power module, power propagates rightward

X20PS3300 is mandatory for remote X2X stations

Deploy multiple PS2100 for segmented feeding on long backplanes

1.2 ERR Red LED steady ON on X20PSxx modules

症状: RUN Green LED ON, ERR steady ON / flashing

原因

1. Backplane internal short circuit (damaged I/O module, deformed backplane pins)
2. Transient overload, supply voltage out of tolerance
3. Failed I/O module pulling down backplane supply

診断: Power off and remove I/O modules sequentially from right to left to locate faulty hardware.

1.3 RUN LED completely OFF on power supply module

Missing external 24 VDC, reversed polarity on X20TB12 terminals, incompletely latched terminals.

2. Backplane & Mechanical Contact Faults

2.4 Intermittent module dropout

症状: Modules randomly reported missing in Automation Studio; fault appears after cabinet vibration or door operation

Root Causes

1. Incomplete backplane interconnection between adjacent X20 modules
2. Loose DIN rail; vibration causes intermittent contact
3. 酸化 / deformation of backplane spring contacts due to repeated disassembly

Countermeasure: Re-seat all modules; minimize frequent disassembly under high-vibration operating conditions.

2.5 Single module undetected while other modules on same backplane work normally

1. Damaged backplane connector on the module
2. Hardware revision mismatch with project configuration
3. Permanent internal hardware failure of module
4. X2X Link Remote Expansion Bus Faults (Common on-site issue)

3.6 Complete loss of communication to all modules on remote X2X station

症状: Fault reported for entire remote station; X2X bus error displayed on master controller

Primary triggers:

1. X20PS2100 incorrectly used at remote station (unable to supply X2X bus power)
2. Damaged X2X communication cable; missing or duplicate 120 Ω terminating resistor
3. Duplicate or incorrectly set node address switches on X20BM05
4. ない 24 V supply to remote station

✅ Standard rule: Install only one 120 Ω terminating resistor at one end of X2X bus

3.7 Frequent X2X communication errors, cyclic station dropout

Almost always induced by EMC interference:

X2X cables routed parallel to high-power drive cables over long distances

Multiple earthing points for control cabinets, potential difference between 0V and PE

Missing filters for inverters and servo drives

4. デジタル I/O (から / する) Typical Faults

4.8 DI input inactive despite valid signal measured externally

1. Insufficient backplane supply voltage
2. ない / broken COM common wiring for DI channels
3. Sensor sourcing/sinking type mismatched with DI module specifications
4. 焼けた入力チャンネル

4.9 DO output fails to drive load / permanently ON / オフ

1. Missing external load power supply for DO modules (Backplane supply ≠ actuator supply on most X20DO modules)
2. Blown on-board electronic fuse due to channel short circuit
3. Excessively long task cycle causing delayed output refresh
4. No freewheeling diode fitted for inductive loads (電磁弁), leading to channel breakdown

4.10 Massive damage to multiple DO channels

High probability: Surge voltage breakdown caused by inductive loads without freewheeling protection.

5. アナログI/O (AI / へ) Frequent Faults

5.11 AI signal drift, unstable fluctuating readings

1 根本的な原因: 電磁妨害

1. Unshielded analog cables; shield grounded at both ends (shield must be single-end grounded inside cabinet)
2. Analog cables routed within same cable duct as power cables

Other causes:

Excessive voltage drop at sensor supply

Open circuit in 4~20 mA loop (module usually displays minimum value)

Poor contact at voltage input terminals

5.12 AI value locked at upper or lower limit

Open circuit in 4~20mA loop → reading near minimum (~4mA);

Short circuit at sensor → reading near maximum (～20mA).

5.13 AO output fails to reach setpoint, insufficient drive capability

Load impedance exceeds module specification; loose wiring terminals; insufficient backplane supply.

6. ソフトウェア & Automation Studio Configuration Faults (Easily misjudged as hardware failure)

6.14 Persistent “Module mismatch” error after project download

症状: Hardware physically installed, but AS reports module mismatch

原因:

1. Wrong model selected in project hardware tree
2. Module hardware revision too old, incompatible with active firmware
3. Hardware scan not updated after module replacement

6.15 Module detected normally, but I/O signals do not refresh

1. 不正な I/O マッピング アドレス
2. I/O processing not enabled within assigned task
3. Channel enable parameter disabled in module configuration (supported on selected modules)

6.16 Random faults induced by firmware incompatibility

CPU firmware revision outdated and incompatible with newer X20 modules; symptoms include random module dropout and communication instability.

7. Complex EMC & Earthing Related Faults (Hardest to troubleshoot)

Typical feature: Fault occurs randomly; system works under no-load condition, errors emerge once loads are activated

1. Multiple earthing points on 24 V 0V and PE create ground loops → analog signal drift, intermittent X2X dropout
2. Unshielded power cables for inverters and servos induce interference onto backplane bus
3. Isolation missing between 24 V supplies of different control cabinets, generating potential difference and communication disturbance

推奨スペック: Single-point earthing for 24 VDC 0V; cable shield grounded only inside the control cabinet.

8. Environmentally Induced Faults
9. Condensation → backplane leakage, random short circuits, permanent module burnout
10. Operating temperature exceeded (水平 60 ℃, 垂直 50 ℃) → abnormal module behavior, spontaneous reset
11. Dust and oil contamination on terminals and backplane → poor contact

Standard Tiered Troubleshooting Procedure for On-site Maintenance

1. Verify all X20PS power supply units; 確認する 24 VDC within range: 20.4~28.8 V
2. Define fault scope: Single module fault / Entire backplane segment / All remote X2X stations
3. Entire segment fault → Inspect power modules, BM layout, X2X bus power (Distinguish PS2100 and PS3300)
4. Single channel fault → Inspect external wiring, sensors/actuators, common terminals, load surge protection
5. Random intermittent faults → Prioritize inspection of mechanical seating, EMC interference and earthing system