Panasonic HGC1100P CMOS Micro Laser Displacement Sensor

Reference distance 100 mm, Measuring range ±35 mm；PNP-Ausgang；2 m fixedcable version

Aufschlüsselung des Modellcodes

Codesegment	Definition
HG‑C	Produktserie: CMOS Micro Laser Displacement Sensor
1100	Reference distance 100 mm, measuring range ±35 mm
‑P	PNP open‑collector output；Model without ‑P = NPN output (HG‑C1100)

Kernelektrik & Mechanische Spezifikationen

Artikel	Spezifikationen
Reference measuring distance	100 mm
Messbereich	±35 mm (65～135 mm)
Wiederholbarkeit	70 μm
Linearität	±0.1 % F.S.
Temperature characteristic	0.03 % F.S./℃
Laser source	Roter Halbleiterlaser, Class 2, 655 nm, max. 1 mW, beam spot φ120 μm(at reference distance)
Stromversorgung	DC 12‑24 V ±10 %, ripple P‑P ≤10 %
Current consumption	≤40 mA @24 V；≤65 mA @12 V
Switch output	PNP open‑collector；max. source current 50 mA；Light‑ON / Dark‑ON selectable；auto‑recovery short‑circuit protection built‑in
Analoger Ausgang	Stromspannung: 0‑5 V (alarm 5.2 V)；Aktuell: 4‑20 mA (alarm 0 mA)
Ansprechzeit	Umschaltbar: 1.5 ms / 5 MS / 10 MS
Externer Eingang	PNP non‑contact input; assignable functions: Zero‑set, Teach, Laser OFF, External trigger
Protection rating	IP67
Betriebstemperatur	‑10～+45 ℃ (No dew‑condensation or icing allowed)；Lagerung:‑20～+60 ℃
Vibrationsfestigkeit	10‑55 Hz, 1.5 mm double amplitude on all axes, 2 h；Shock resistance 500 m/s²(50 G), 3 times per axis
Kabel	5‑core composite cable, standard 2 m；max. total extension length 10 m with ≥0.3 mm² conductors
Gewicht	Approx. 85 g (including cable)；Die‑cast aluminum housing, acrylic front cover
Zertifizierungen	CE, UKCA, RoHS, FDA, UL/c‑UL

Verkabelungsdefinition (PNP Version HGC1100P)

5core cable color assignment:

Cable Color	Signal	Beschreibung
Braun	+V	DC12‑24 V power positive
Blau	0V	Power ground
Schwarz	Control Output	PNP-Schaltausgang
Pink	Externer Eingang	PNP external function input (Zero‑set / Teach / Laser OFF / Trigger)
Grau	Analoger Ausgang	Shared for 0‑5 V voltage & 4‑20 mA current
Schild	AGND	Analog ground, connect to PLC analog module ground

External input valid condition: +4 V～+V；Invalid: 00.6 V or open circuit.

Intraseries Model Comparison

Modell	Reference Distance	Messbereich	Wiederholbarkeit	Ausgabe
HG‑C1030‑P	30 mm	±5 mm	10 μm	PNP
HG‑C1050‑P	50 mm	±15 mm	30 μm	PNP
HG‑C1100‑P	100 mm	±35 mm	70 μm	PNP
HG‑C1200‑P	200 mm	±80 mm	200 μm	PNP
HG‑C1400‑P	400 mm	±200 mm	300‑800 μm	PNP

Packungsinhalt & Optionales Zubehör

Standardlieferung

HGC1100P sensor main unit (integrated 2 m cable) ×1
Hardcopy instruction manual ×1

Nonstandard, order separately

MSHG01 stainlesssteel mounting bracket (for M3 screws)

M3 mounting screws are NOT supplied with sensor.

Typische Anwendungsszenarien
Dicke, stepheight & warpage measurement (plates, Leiterplatte, thinfilm materials)
Robot height closedloop positioning, insertiondepth inspection for actuators
Remainingmaterial detection for packaging lines, overlap / presence detection
Part orientation discrimination, Oring/gasket presence verification
IP67 rated for splashprone production stations (measurement failure occurs if lens dewcondensates)
Auswahlnotizen & Verbotene Operationen
✘ Do NOT let target object go outside 65135 mm measuring range, insufficientlight alarm will trigger and analog output will switch to alarm level.
✘ Do NOT scratch acrylic front cover; NO organic solvent cleaning. Only clean with lintfree soft cloth.
✘ Strictly avoid dewcondensation and icing. IP67 does NOT prevent internal condensation which directly causes measurement error.
✘ Route sensor cables separately from highpower cables to avoid measurement drift; singleend grounding for analog shielded cable is recommended.
✘ Specularreflective or highlytransparent workpieces produce abnormal readings; matte diffusereflective targets yield optimal performance.
✘ Laser Class 2: Never stare directly into laser beam spot.
✘ Extended cables must be ≥0.3 mm² crosssection; total cable length shall not exceed 10 m.
Fehlerbehebungstabelle

Fehlersymptom	Possible Root Cause	Abhilfemaßnahme
Insufficient‑light alarm	Target out‑of‑range, misalignment, low target reflectivity	Ensure target stays within 65‑135 mm; adjust mounting angle; improve target reflectance
Output short‑circuit alarm	Load short‑circuit on output channel	Ausschalten, inspect wiring and load; sensor auto‑resets after fault removal
Laser hardware failure	Laser diode damage	Contact manufacturer for repair; no on‑site fix available
EEPROM abnormality	Internal memory corruption	Contact manufacturer for repair
Zero‑set failure	Target out‑of‑measuring‑range or offset mode active	Place target within valid range; exit Offset mode

Crossmodel Compatibility & Ersatzreferenz
Panasonic intraseries NPN alternative: HGC1100 (only output polarity differs; all other specs identical)
Thirdparty alternatives: Keyence IL065; Omron ZX2LD100. Evaluate beam spot, repeatability and analogoutput wiring before retrofitting.

Crossbrand Model Comparison for Panasonic HGC1100P

Reference baseline specs: Reference distance 100 mm, measuring range ±35 mm (65135 mm), repeatability 70 μm, PNP-Schaltausgang + 05 V /420 mA analog output, IP67, 1.5/5/10 ms switchable response time, Class 2 red laser, integrated body with local display & keys.

⚠️ No dropin 100pin / footprint compatible replacement. Retuning wiring, PLC scaling and mounting bracket are mandatory for any crossbrand swap.

Imported Brand Comparison Table

Marke	Referenzmodell	Wiederholbarkeit	Ausgabe	Hauptunterschiede	Replacement Evaluation
Panasonic	HG‑C1100‑P	70 μm	PNP;0‑5V/4‑20 mA;Externer Eingang;Local display & keys	Baseline reference unit	Referenzmodell
Keyence	IL‑100	40 μm	PNP/NPN;0‑5V/4‑20 mA; IO‑Link;Local display	Narrower measuring range ±30, different housing dimension, Class 1 laser, smaller spot, höhere Kosten	Performance‑oriented alternative; watch range boundary limits
Omron	ZX2‑LD100 + ZX2‑LDA41 amplifier	50 μm	Requires separate amplifier unit; analog + switch output	Split‑head & amplifier system, NOT all‑in‑one unit, completely different cabling layout	Major modification workload; cannot reuse existing integrated‑sensor installation space
KRANK	OD2‑100T1	80 μm	PNP;0‑10V/4‑20 mA;IO‑Link	Analog voltage output 0‑10 V (not 0‑5 V), PLC scaling logic must be rewritten, different housing size	Identical measuring range; PLC program modification required

Domestic Allinone Alternatives (Fixedcable, PNP + dual analog outputs, local digital display)

Marke	Referenzmodell	Reference Distance	Hauptunterschiede	Replacement Evaluation
Atonm(Atom)	LD1‑H100‑P	100 mm	Very close parameters; mounting hole pattern differs; Temp. drift 0.03 %F.S./℃; Class 2 laser	Preferred domestic retrofit option. Measuring range fully matched; only mounting bracket needs rework
Lanbao	PDE‑CR100TGIU‑P	100 mm	Additional RS485 digital interface; different housing; spot φ120 μm, Class 2 laser	Suitable for applications requiring digital data upload

Panasonic OEM Internal Replacements

HGC1100: NPNoutput variant, optical / Reichweite / mechanical dimensions unchanged. Only output polarity differs; PLC wiring must be adjusted.
HGC1100L3PJ: M12connector version (replaces fixed 2 m cable), IOLink supported, identical optical specs. Requires M12type cable assembly.

⚠️ Critical Replacement Risk Reminders

Measuringrange boundary difference: Keyence IL100 works 75130 mm, narrower than HGC1100P 65135 mm. If original process uses the 6575 mm nearend zone, IL100 will trigger insufficientlight alarms and is not directly applicable.
Analog voltage mismatch: SICK OD2100T1 outputs 010 V while Panasonic outputs 05 V. PLC analog channel scaling formulas must be rewritten.
Splitsystem trap: Omron ZX2LD100 is only a sensor head; amplifier ZX2LDA41 is mandatory. Extra cabinet space is needed; high retrofitting overhead.
Mechanical mounting: All thirdparty competitors have different housing outlines and M3 mounting hole layouts. Original mounting bracket MSHG01 cannot be reused; new bracket / machining required.
Externalinput logic: Valid PNP input voltage thresholds vary across brands. Reverify zeroset / teach / trigger signal levels against target datasheet after replacement.

✅ Quick Selection Guidelines

Minimalmodification, keep original scaling logic: Atonm LD1H100P, full 65135 mm range match, dual 05 V /420 mA analog outputs.
Higher stability, sufficient budget: Keyence IL100, respect minimum measurable distance 75 mm constraint.
IOLink communication required: SICK OD2100T1, be sure to rewrite PLC scaling code.
Avoid: Omron ZX2 series, high modification workload for splitamplifier architecture.

Application Scenarios — Panasonic HGC1100P Laser Displacement Sensor

Core specs recap: Reference distance 100 mm, measuring range 65135 mm (±35 mm), repeatability 70 μm, PNP switching +05 V/420 mA analog outputs, IP67, Class 2 red laser. Optimized for distance, Höhe, stepheight and warpage measurement on diffusereflective targets. Not suitable for specularreflective or highly transparent objects.

📦 Packaging & Logistics Industry

Remainingroll diameter detection: Monitor residual thickness of film / adhesivetape rolls; trigger rollchange alert at lowresidual threshold.
Packagingarticle height inspection: Verify stack height of cartons / bags; detect missing parts, shortheight or overfilled packages.
Sealingtape presence & warpage inspection: Detect tape lifting / missing tape; identify warped package edges.
Materiallevel height detection: Measure material height inside magazine / bin for lowmaterial / fullbin judgement.

🔧 Automotive Component Manufacturing

Gasket / Oring assembly verification: Judge proper seating, missing installation or protrusion via height difference measurement.
Stampedpart stepheight & flatwarpage inspection: Evaluate flatness and step height of sheetmetal stampings; identify deformation or missing material.
Injectionmold gateresidue height inspection: Judge whether gate residual height is outoftolerance for NG rejection.
Fixture workpiecepresence check: Verify insertion depth; detect misplaced or reversed parts.

📜 Electronics & PCB Industry

PCB board warpage measurement: Quantify circuitboard bending deformation for outoftolerance judgement.
Gasket / contactspring height inspection: Measure compressed height of connector springs; detect damaged or missing springs.
Indirect thinfilm thickness measurement: Dualsensor opposedsetup for filmthickness measurement; singlesensor measures surfaceheight variation over base substrate.

⚠️ Direct measurement on transparent thinfilm causes signal loss; use diffusereflective backing plate.

🤖 Robotics & Allgemeine Automatisierung

Robot height positioning: Heightranging before robot grasping for closedloop height compensation.
Toolingfixture height verification: Inspect locatingsurface height of production fixtures to identify fixture wear.
Assembly pressfit depth monitoring: Realtime monitoring of component insertion / pressin depth; alarm for pressfit defects.

🏭 Generalpurpose Machining

Plate height / offset detection: Measure height of aluminum / plastic plates; detect offset or lifting.
Rollgap monitoring: Track rollergap variation to detect roller wear.
Workpiecethickness differential sorting: Detect height difference across batches to perform OK / NG part sorting.

💧 Splashprone Working Conditions (IP67)

Applicable for stations with occasional water splashes. Lens dewcondensation / icing is strictly forbidden. Condensed water vapor directly induces measurement drift and failure.

❌ Nonapplicable Scenarios (Auswahlfallen)

Specularhighreflectivity workpieces: Strong specular reflection bounces laser directly back to sensor → unstable jumping readings.
Fully transparent / hightransmittance workpieces (Glas, clear PET): Laser passes through target, no usable return light.
Continuous dewcondensation / icing environment: IP67 rating cannot resist internal condensation.
Working distance persistently outside 65135 mm: Insufficientlight alarm is triggered.