Panasonic HGC1100P CMOS Micro Laser Displacement Sensor

Reference distance 100 mm, Measuring range ±35 mm；salida PNP；2 m fixedcable version

Desglose del código del modelo

Segmento de código	Definición
HG‑C	Serie de productos: CMOS Micro Laser Displacement Sensor
1100	Reference distance 100 mm, measuring range ±35 mm
‑P	PNP open‑collector output；Model without ‑P = NPN output (HG‑C1100)

Núcleo Eléctrico & Especificaciones mecánicas

Artículo	Presupuesto
Reference measuring distance	100 milímetros
Measuring range	±35 mm (65～135 mm)
Repeatability	70 μm
Linealidad	±0.1 % F.S.
Temperature characteristic	0.03 % F.S./℃
Laser source	Láser semiconductor rojo, Class 2, 655 nm, max. 1 mW, beam spot φ120 μm(at reference distance)
Fuente de alimentación	DC 12‑24 V ±10 %, ripple P‑P ≤10 %
Consumo actual	≤40 mA @24 V；≤65 mA @12 V
Switch output	PNP open‑collector；máximo. source current 50 mA；Light‑ON / Dark‑ON selectable；auto‑recovery short‑circuit protection built‑in
Salida analógica	Voltaje: 0‑5 V (alarm 5.2 V)；Actual: 4‑20 mA (alarm 0 mA)
Tiempo de respuesta	Switchable: 1.5 ms / 5 ms / 10 ms
Entrada externa	PNP non‑contact input; assignable functions: Zero‑set, Teach, Laser OFF, External trigger
Clasificación de protección	IP67
Temperatura de funcionamiento	‑10～+45 ℃ (No dew‑condensation or icing allowed)；Almacenamiento:‑20～+60 ℃
Resistencia a las vibraciones	10‑55 Hz, 1.5 mm double amplitude on all axes, 2 h；Shock resistance 500 m/s²(50 G), 3 times per axis
Cable	5‑core composite cable, standard 2 m；máximo. total extension length 10 m with ≥0.3 mm² conductors
Peso	Approx. 85 g (incluyendo cable)；Die‑cast aluminum housing, acrylic front cover
Certificaciones	CE, Reino Unido, RoHS, FDA, UL/c‑UL

Wiring Definition (PNP Version HGC1100P)

5core cable color assignment:

Color de cables	Señal	Descripción
Marrón	+V	DC12‑24 V power positive
Azul	0V	Power ground
Negro	Salida de control	Salida de conmutación PNP
Rosa	Entrada externa	PNP external function input (Zero‑set / Teach / Laser OFF / Trigger)
Gris	Salida analógica	Shared for 0‑5 V voltage & 4‑20 mA current
Blindaje	AGND	Analog ground, connect to PLC analog module ground

External input valid condition: +4 V～+V；Invalid: 00.6 V or open circuit.

Intraseries Model Comparison

Modelo	Reference Distance	Rango de medición	Repeatability	Producción
HG‑C1030‑P	30 milímetros	±5 mm	10 μm	PNP
HG‑C1050‑P	50 milímetros	±15 mm	30 μm	PNP
HG‑C1100‑P	100 milímetros	±35 mm	70 μm	PNP
HG‑C1200‑P	200 milímetros	±80 mm	200 μm	PNP
HG‑C1400‑P	400 milímetros	±200 mm	300‑800 μm	PNP

Package Contents & Accesorios opcionales

Standard Delivery

HGC1100P sensor main unit (integrated 2 m cable) ×1
Hardcopy instruction manual ×1

Nonstandard, order separately

MSHG01 stainlesssteel mounting bracket (for M3 screws)

M3 mounting screws are NOT supplied with sensor.

Escenarios de aplicación típicos
Thickness, stepheight & warpage measurement (plates, tarjeta de circuito impreso, thinfilm materials)
Robot height closedloop positioning, insertiondepth inspection for actuators
Remainingmaterial detection for packaging lines, overlap / presence detection
Part orientation discrimination, Oring/gasket presence verification
IP67 rated for splashprone production stations (measurement failure occurs if lens dewcondensates)
Notas de selección & Operaciones prohibidas
✘ Do NOT let target object go outside 65135 mm measuring range, insufficientlight alarm will trigger and analog output will switch to alarm level.
✘ Do NOT scratch acrylic front cover; NO organic solvent cleaning. Only clean with lintfree soft cloth.
✘ Strictly avoid dewcondensation and icing. IP67 does NOT prevent internal condensation which directly causes measurement error.
✘ Route sensor cables separately from highpower cables to avoid measurement drift; singleend grounding for analog shielded cable is recommended.
✘ Specularreflective or highlytransparent workpieces produce abnormal readings; matte diffusereflective targets yield optimal performance.
✘ Laser Class 2: Never stare directly into laser beam spot.
✘ Extended cables must be ≥0.3 mm² crosssection; total cable length shall not exceed 10 m.
Troubleshooting Table

Síntoma de falla	Possible Root Cause	Remedial Action
Insufficient‑light alarm	Target out‑of‑range, misalignment, low target reflectivity	Ensure target stays within 65‑135 mm; adjust mounting angle; improve target reflectance
Output short‑circuit alarm	Load short‑circuit on output channel	Apagar, inspect wiring and load; sensor auto‑resets after fault removal
Laser hardware failure	Laser diode damage	Póngase en contacto con el fabricante para su reparación.; no on‑site fix available
Anomalía de la EEPROM	Internal memory corruption	Póngase en contacto con el fabricante para su reparación.
Zero‑set failure	Target out‑of‑measuring‑range or offset mode active	Place target within valid range; exit Offset mode

Crossmodel Compatibility & Referencia de reemplazo
Panasonic intraseries NPN alternative: HGC1100 (only output polarity differs; all other specs identical)
Thirdparty alternatives: Keyence IL065; Omron ZX2LD100. Evaluate beam spot, repeatability and analogoutput wiring before retrofitting.

Crossbrand Model Comparison for Panasonic HGC1100P

Reference baseline specs: Reference distance 100 mm, measuring range ±35 mm (65135 milímetros), repeatability 70 μm, Salida de conmutación PNP + 05 V /420 mA analog output, IP67, 1.5/5/10 ms switchable response time, Class 2 red laser, integrated body with local display & keys.

⚠️ No dropin 100pin / footprint compatible replacement. Retuning wiring, PLC scaling and mounting bracket are mandatory for any crossbrand swap.

Imported Brand Comparison Table

Marca	Reference Model	Repeatability	Producción	Diferencias clave	Replacement Evaluation
Panasonic	HG‑C1100‑P	70 μm	PNP;0‑5V/4‑20 mA;Entrada externa;Pantalla local & keys	Baseline reference unit	Modelo de referencia
Keyence	IL‑100	40 μm	PNP/NPN;0‑5V/4‑20 mA; IO‑Link;Pantalla local	Narrower measuring range ±30, different housing dimension, Class 1 laser, smaller spot, mayor costo	Performance‑oriented alternative; watch range boundary limits
Omrón	ZX2‑LD100 + ZX2‑LDA41 amplifier	50 μm	Requires separate amplifier unit; cosa análoga + switch output	Split‑head & amplifier system, NOT all‑in‑one unit, completely different cabling layout	Major modification workload; cannot reuse existing integrated‑sensor installation space
ENFERMO	OD2‑100T1	80 μm	PNP;0‑10V/4‑20 mA;IO‑Link	Analog voltage output 0‑10 V (not 0‑5 V), PLC scaling logic must be rewritten, different housing size	Identical measuring range; PLC program modification required

Domestic Allinone Alternatives (Fixedcable, PNP + dual analog outputs, local digital display)

Marca	Reference Model	Reference Distance	Diferencias clave	Replacement Evaluation
Atonm(Atom)	LD1‑H100‑P	100 milímetros	Very close parameters; mounting hole pattern differs; temperatura. drift 0.03 %F.S./℃; Class 2 laser	Preferred domestic retrofit option. Measuring range fully matched; only mounting bracket needs rework
Lanbao	PDE‑CR100TGIU‑P	100 milímetros	Additional RS485 digital interface; different housing; spot φ120 μm, Class 2 laser	Suitable for applications requiring digital data upload

Panasonic OEM Internal Replacements

HGC1100: NPNoutput variant, optical / rango / mechanical dimensions unchanged. Only output polarity differs; PLC wiring must be adjusted.
HGC1100L3PJ: M12connector version (replaces fixed 2 m cable), IOLink supported, identical optical specs. Requires M12type cable assembly.

⚠️ Critical Replacement Risk Reminders

Measuringrange boundary difference: Keyence IL100 works 75130 mm, narrower than HGC1100P 65135 mm. If original process uses the 6575 mm nearend zone, IL100 will trigger insufficientlight alarms and is not directly applicable.
Analog voltage mismatch: SICK OD2100T1 outputs 010 V while Panasonic outputs 05 V. PLC analog channel scaling formulas must be rewritten.
Splitsystem trap: Omron ZX2LD100 is only a sensor head; amplifier ZX2LDA41 is mandatory. Extra cabinet space is needed; high retrofitting overhead.
Mechanical mounting: All thirdparty competitors have different housing outlines and M3 mounting hole layouts. Original mounting bracket MSHG01 cannot be reused; new bracket / machining required.
Externalinput logic: Valid PNP input voltage thresholds vary across brands. Reverify zeroset / teach / trigger signal levels against target datasheet after replacement.

✅ Quick Selection Guidelines

Minimalmodification, keep original scaling logic: Atonm LD1H100P, full 65135 mm range match, dual 05 V /420 mA analog outputs.
Higher stability, sufficient budget: Keyence IL100, respect minimum measurable distance 75 mm constraint.
IOLink communication required: SICK OD2100T1, be sure to rewrite PLC scaling code.
Evitar: Omron ZX2 series, high modification workload for splitamplifier architecture.

Application Scenarios — Panasonic HGC1100P Laser Displacement Sensor

Core specs recap: Reference distance 100 mm, measuring range 65135 mm (±35 mm), repeatability 70 μm, PNP switching +05 V/420 mA analog outputs, IP67, Class 2 red laser. Optimized for distance, altura, stepheight and warpage measurement on diffusereflective targets. Not suitable for specularreflective or highly transparent objects.

📦 Packaging & Industria Logística

Remainingroll diameter detection: Monitor residual thickness of film / adhesivetape rolls; trigger rollchange alert at lowresidual threshold.
Packagingarticle height inspection: Verify stack height of cartons / bags; detect missing parts, shortheight or overfilled packages.
Sealingtape presence & warpage inspection: Detect tape lifting / missing tape; identify warped package edges.
Materiallevel height detection: Measure material height inside magazine / bin for lowmaterial / fullbin judgement.

🔧 Automotive Component Manufacturing

Gasket / Oring assembly verification: Judge proper seating, missing installation or protrusion via height difference measurement.
Stampedpart stepheight & flatwarpage inspection: Evaluate flatness and step height of sheetmetal stampings; identify deformation or missing material.
Injectionmold gateresidue height inspection: Judge whether gate residual height is outoftolerance for NG rejection.
Fixture workpiecepresence check: Verify insertion depth; detect misplaced or reversed parts.

📜 Electronics & PCB Industry

PCB board warpage measurement: Quantify circuitboard bending deformation for outoftolerance judgement.
Gasket / contactspring height inspection: Measure compressed height of connector springs; detect damaged or missing springs.
Indirect thinfilm thickness measurement: Dualsensor opposedsetup for filmthickness measurement; singlesensor measures surfaceheight variation over base substrate.

⚠️ Direct measurement on transparent thinfilm causes signal loss; use diffusereflective backing plate.

🤖 Robotics & General Automation

Robot height positioning: Heightranging before robot grasping for closedloop height compensation.
Toolingfixture height verification: Inspect locatingsurface height of production fixtures to identify fixture wear.
Assembly pressfit depth monitoring: Realtime monitoring of component insertion / pressin depth; alarm for pressfit defects.

🏭 Generalpurpose Machining

Plate height / offset detection: Measure height of aluminum / plastic plates; detect offset or lifting.
Rollgap monitoring: Track rollergap variation to detect roller wear.
Workpiecethickness differential sorting: Detect height difference across batches to perform OK / NG part sorting.

💧 Splashprone Working Conditions (IP67)

Applicable for stations with occasional water splashes. Lens dewcondensation / icing is strictly forbidden. Condensed water vapor directly induces measurement drift and failure.

❌ Nonapplicable Scenarios (Errores de selección)

Specularhighreflectivity workpieces: Strong specular reflection bounces laser directly back to sensor → unstable jumping readings.
Fully transparent / hightransmittance workpieces (vaso, clear PET): Laser passes through target, no usable return light.
Continuous dewcondensation / icing environment: IP67 rating cannot resist internal condensation.
Working distance persistently outside 65135 mm: Insufficientlight alarm is triggered.