Siemens 6ES7512-1DK01-0AB0 CPU

Siemens 6ES7512-1DK01-0AB0 CPU 1512SP-1 PN (ET200SP Distributed CPU)

Stato del prodotto: Discontinued PM410, spare parts supply available; upgrade replacement model: 6ES7512-1DM03-0AB0

Model Code Bit-by-Bit Breakdown

Segmento di codice	Definizione
6ES7	SIMATIC S7 automation system
512	CPU 1512SP series
1DK01	Versione dell'hardware: program memory 200 KB, data memory 1 MB; ET200SP on‑board CPU
0AB0	Versione standard, 24 VDC, no conformal coating

Full designation: SIMATIC DP CPU 1512SP-1 PN, S7-1500-architecture CPU for ET200SP distributed station

Core Hardware & Specifiche elettriche

Articolo	Parametro
Working memory	Programma: 200 KB; Data: 1 MB
Load memory	SIMATIC memory card mandatory (massimo. 32 GB); no on‑board internal load memory
Bit‑instruction execution time	48 ns; Word instruction: 58 ns; Fixed‑point instruction: 77 ns
Alimentazione elettrica	24 VDC, permissible range 19.2‑28.8 VDC, reverse‑polarity protection
Corrente nominale	0.6 UN; Massimo. 0.9 UN; Typical power consumption 5.6 W
Interfaccia di comunicazione	PROFINET IRT, integrated 3‑port switch; Port3: built‑in RJ45; Port1/Port2 require optional BusAdapter
Controllo del movimento	Positioning axis support; massimo. 5 axes at 4 ms cycle, massimo. 10 axes at 8 ms cycle; supports PID_Compact / PID_3Step / PID_Temp
Diagnostica	1000‑entry diagnostic buffer, 500 entries non‑volatile; 200 forceable variables; IO&M0‑I&M3 identification data
Programming languages	RAGAZZO / FBD / STL / SCL / GRAPH
Dimensioni	W 100 mm × H 117 mm × D 75 mm; Net weight 0.386 kg

III. Environmental Tolerance Specifications (Condensation not permitted)

Orientamento di montaggio	Temperatura operativa	Temperatura di conservazione
Horizontal DIN‑rail	‑25 ℃ ~ +60 ℃	‑40 ℃ ~ +85 ℃
Vertical DIN‑rail	‑25 ℃ ~ +50 ℃	‑40 ℃ ~ +85 ℃
Massimo. operating altitude	5000 m; derating required above 2000 m

Compatibilità del software

Maximum firmware: V2.9 (FS05)

Portale TIA:

FW V2.9: V17 or higher for full feature support

From FW V1.8: minimum TIA V13 SP1 Update4; older versions can configure in low-firmware mode with some new features unavailable

Funzioni supportate: OPC UA server, PROFINET RT/IRT, isochronous OB6x min. cycle 625 µs; Multi-Hot-Swap for hot-swap modules

Definizione di cablaggio (Power Terminal X80)

Spillo	Segnale	Descrizione
1	1L+	Main power 24 VDC+
2	1M	Main power 0 V
3	2M	Loop output 0 V (daisy‑chain to downstream modules)
4	2L+	Loop output 24 VDC+ (daisy‑chain to downstream modules)

⚠️Important: Port1/Port2 RJ45 ports are not built-into the CPU body, BusAdapter bus adapter must be inserted; Port3 is fixed on-board RJ45 for direct wiring.

Available BusAdapter types: RJ45, M12, FC fast-connect, LC fiber-optic adapter, ecc.

Lista imballaggio & Parti opzionali

✅ Standard delivery scope

CPU 1512SP-1 PN main module
Pre-assembled X80 power connector
Paper manuals, certificate of conformity

❗ Not included, deve essere ordinato separatamente

SIMATIC memory card (obbligatorio, CPU cannot start without it)
BusAdapter bus adapter (for Port1/Port2)
ET200SP base unit BU-type A0; right-side expansion I/O modules
CM-DP PROFIBUS communication module (if DP interface is required)

VII. Cross-Model Replacement Comparison

Comparison item	6ES7512‑1DK01‑0AB0 (old discontinued)	6ES7512‑1DM03‑0AB0 (direct upgrade replacement)
Memoria del programma	200 KB	400 KB
Memoria dati	1 MB	2 MB
Firmware	V2.9	V4.0
Mechanical form factor	Pienamente compatibile, common base units	Pin‑to‑pin & montaggio 1:1 compatibile, direct drop‑in for existing ET200SP stations
Software requirement	TIA V17	TIA V18 / V20

Upgrade note: Existing projects can directly replace the order number in TIA Portal without program-logic modification; match firmware version with memory card.

Extended-temperature coated variant: 6AG2512-1DK01-1AB0 (SIPLUS, -40~+60 ℃ with conformal coating), derived from this base model for harsh environments.

VIII. Scenari applicativi tipici

Distributed field stations: linee di trasporto, macchine per l'imballaggio, control cabinet remote from field; ET200SP operates independently as local CPU
Medium-small machinery: tessile, plastics machinery, smistamento logistico; PROFINET IRT isochronous motion control
Hybrid architecture: acts both as local CPU and intelligent slave communicating with upper-level S7-1500 master
Retrofit projects: legacy-equipment upgrade, compact cabinet footprint, hot-swap I/O for maintenance
Model-Selection Pitfall Guide (Hard Constraints)
❌ Power-on without SIMATIC memory card: CPU fails to start, no program execution
❌ Omit BusAdapter: Port1/Port2 cannot bring out network cables; Port3 on-board RJ45 can be used independently
❌ Vertical mounting max. temperature limited to +50 ℃; do not apply horizontal +60 ℃ specification, otherwise over-temperature alarm occurs
❌ No native EtherCAT support; PROFINET only; Modbus-RTU requires additional CM communication module
❌ Altitude＞2000 m: derate supply voltage and ambient temperature strictly per manual derating curve
✅ Advantage: ET200SP base unit hot-swap; replace I/O modules without station power-down; supports simultaneous multi-device hot-swa
Risoluzione dei problemi comuni

Fenomeno	Causa ultima	Rimedio
MAINT LED steady ON	Missing memory card / defective card / no program on card	Install valid SIMATIC memory card, download project
ERROR red LED lit	Backplane‑bus fault, base‑unit fault, I/O module configuration mismatch	Verify BU base‑unit model; locate faulty module number via online diagnostic buffer
PROFINET communication packet loss	Poor BusAdapter contact; IRT clock‑synchronization conflict	Re‑seat BusAdapter; check OB6x isochronous cycle settings
No RUN LED after power‑on	Firmware‑TIA Portal mismatch; inconsistent firmware on memory card	Update CPU firmware online; upgrade TIA Portal to matching release