Siemens 6ES7512-1DK01-0AB0 CPU

シーメンス 6ES7512-1DK01-0AB0 CPU 1512SP-1 PN (ET200SP Distributed CPU)

商品の状態: Discontinued PM410, spare parts supply available; upgrade replacement model: 6ES7512-1DM03-0AB0

1. Model Code Bit-by-Bit Breakdown

Full designation: SIMATIC DP CPU 1512SP-1 PN, S7-1500-architecture CPU for ET200SP distributed station

1. Core Hardware & 電気仕様

Ⅲ. Environmental Tolerance Specifications (Condensation not permitted)

1. ソフトウェアの互換性

Maximum firmware: V2.9 (FS05)

TIAポータル:

FW V2.9: V17 or higher for full feature support

From FW V1.8: minimum TIA V13 SP1 Update4; older versions can configure in low-firmware mode with some new features unavailable

サポートされている機能: OPC UA server, PROFINET RT/IRT, isochronous OB6x min. cycle 625 µs; Multi-Hot-Swap for hot-swap modules

1. 配線の定義 (Power Terminal X80)

⚠️Important: Port1/Port2 RJ45 ports are not built-into the CPU body, BusAdapter bus adapter must be inserted; Port3 is fixed on-board RJ45 for direct wiring.

Available BusAdapter types: RJ45, M12, FC fast-connect, LC fiber-optic adapter, 等.

1. 包装内容明細書 & オプションパーツ

✅ Standard delivery scope

1. CPU 1512SP-1 PN main module
2. Pre-assembled X80 power connector
3. Paper manuals, 適合証明書

❗ Not included, must be ordered separately

1. SIMATIC memory card (mandatory, CPU cannot start without it)
2. BusAdapter bus adapter (for Port1/Port2)
3. ET200SP base unit BU-type A0; right-side expansion I/O modules
4. CM-DP PROFIBUS communication module (if DP interface is required)

Ⅶ. Cross-Model Replacement Comparison

Upgrade note: Existing projects can directly replace the order number in TIA Portal without program-logic modification; match firmware version with memory card.

Extended-temperature coated variant: 6AG2512-1DK01-1AB0 (SIPLUS, -40~+60 ℃ with conformal coating), derived from this base model for harsh environments.

VIII. 典型的なアプリケーションシナリオ

1. Distributed field stations: コンベアライン, 包装機械, control cabinet remote from field; ET200SP operates independently as local CPU
2. Medium-small machinery: 繊維, plastics machinery, 物流仕分け; PROFINET IRT isochronous motion control
3. Hybrid architecture: acts both as local CPU and intelligent slave communicating with upper-level S7-1500 master
4. Retrofit projects: legacy-equipment upgrade, compact cabinet footprint, hot-swap I/O for maintenance
5. Model-Selection Pitfall Guide (Hard Constraints)
6. ❌ Power-on without SIMATIC memory card: CPU fails to start, no program execution
7. ❌ Omit BusAdapter: Port1/Port2 cannot bring out network cables; Port3 on-board RJ45 can be used independently
8. ❌ Vertical mounting max. temperature limited to +50 ℃; do not apply horizontal +60 ℃ specification, otherwise over-temperature alarm occurs
9. ❌ No native EtherCAT support; PROFINETのみ; Modbus-RTU requires additional CM communication module
10. ❌ Altitude＞2000 m: derate supply voltage and ambient temperature strictly per manual derating curve
11. ✅ Advantage: ET200SP base unit hot-swap; replace I/O modules without station power-down; supports simultaneous multi-device hot-swa
12. 一般的な障害のトラブルシューティング